|Statement||Robert T. Howard, project coordinator ; editors: Stephen S. Furkay, Richard F. Kilburn, Gabriel Monti.|
|Contributions||Howard, Robert T., Furkay, Stephen S., Kilburn, Richard F., Monti, Gabriel, International Society for Hybrid Microelectronics.|
|LC Classifications||TK7874 T46 1984|
|The Physical Object|
|Pagination||xxiii, 362 p. :|
|Number of Pages||362|
The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices. ASME Press Book Series on Electronic Packaging. Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices. ASME Press Book Series on Electronic Packaging. - Lian-Tua Yeh (Lockheed Martin Vought Syst, Propulsion and Thermodynamics, PO Box , MS SP, Dallas TX ) and RC Chu (Dept AYJB, M/S P, IBM Corp, South Rd Author: Lian-Tua Yeh, RC Chu, WS Janna. Thermal management goes hand in hand with microelectronics packaging. In this chapter, we will present the motivations and the basic concepts of thermal management by heat sink materials, such as heat flux, thermal resistance, and thermal circuits.
Specifically, microelectronic packaging involves rout-ing signals while maintaining signal integrity, dis-tributing ground and power to ICs, dispersing dissipat-ed thermal energy while maintaining structural and material integrity, and protecting the circuit from en-vironmental hazards. Almost all of the methods for packaging ICs include. This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing. fundamentals of microelectronics Download fundamentals of microelectronics or read online books in PDF, EPUB, Tuebl, and Mobi Format. Click Download or Read Online button to get fundamentals of microelectronics book now. This site is like a library, Use search .
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. Thermal management of microelectronic equipment: heat transfer theory, analysis methods, and design practices / L.T. Yeh, R.C. Chu. Series ASME Press book series on electronic packaging. Browse Subjects Electronic apparatus and appliances Cooling. Electronic apparatus and appliances Thermal properties. Thermal management goes hand in hand with microelectronics packaging. We will present the motivations and the basic concepts of thermal management by heat sink materials, such as heat flux, thermal resistance, and thermal circuits. Next we will introduce the levels and classifications of packaging and the functions of microelectronics packaging. Electronic packaging refers to enclosures for integrated circuits, passive devices and circuit cards (Fig. ).The effectiveness of an electronic system, as well as its reliability and cost, is strongly determined by the packaging materials used. 14 This is of fundamental importance for signal and power transmission, heat dissipation, electromagnetic interference shielding and protection from.