Thermal management concepts in microelectronic packaging
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Published by International Society for Hybrid Microelectronics in Silver Spring, Md .
Written in English

Subjects:

  • Microelectronic packaging,
  • Electronic apparatus and appliances -- Temperature control,
  • Thermal analysis

Book details:

Edition Notes

Includes bibliographies.

StatementRobert T. Howard, project coordinator ; editors: Stephen S. Furkay, Richard F. Kilburn, Gabriel Monti.
ContributionsHoward, Robert T., Furkay, Stephen S., Kilburn, Richard F., Monti, Gabriel, International Society for Hybrid Microelectronics.
Classifications
LC ClassificationsTK7874 T46 1984
The Physical Object
Paginationxxiii, 362 p. :
Number of Pages362
ID Numbers
Open LibraryOL19478121M
ISBN 100930815017
OCLC/WorldCa11405125

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. Thermal management of microelectronic equipment: heat transfer theory, analysis methods, and design practices / L.T. Yeh, R.C. Chu. Series ASME Press book series on electronic packaging. Browse Subjects Electronic apparatus and appliances Cooling. Electronic apparatus and appliances Thermal properties. Thermal management goes hand in hand with microelectronics packaging. We will present the motivations and the basic concepts of thermal management by heat sink materials, such as heat flux, thermal resistance, and thermal circuits. Next we will introduce the levels and classifications of packaging and the functions of microelectronics packaging. Electronic packaging refers to enclosures for integrated circuits, passive devices and circuit cards (Fig. ).The effectiveness of an electronic system, as well as its reliability and cost, is strongly determined by the packaging materials used. 14 This is of fundamental importance for signal and power transmission, heat dissipation, electromagnetic interference shielding and protection from.